(English) TT-71LA13-TIM

DESCRIZIONE PRODOTTO

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Product Features

IT-71LA13-TIM is a HD thermal imaging module based on the independently developed XGA (1024 x 768) sensor. Since the array format of XGA is 2.4 times the size of VGA, IT-71LA13-TIM can provide larger FOV, extending the detection limits. IT-71LA13-TIM thermal imaging module can output fairly clear image during day, night and other challenging environment conditions such as smoke, dust, haze and fog.

Basic Functions

Independently developed VOx focal plane arrays
Resolution: 1024 x 768, Pixel pitch: 14 µm
High sensitivity: NETD ≤ 50mK
Professional image processing: Digital denoise, Digital detail enhancement (DDE),
Non-Uniformity Correction (NUC)
Various interfaces optional: RS-232, RS-422, UART (3.3V)
Digital video : LVDS, LVCMOS , Cameralink
Weight: ≤ 100g

SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.

(English)

TECHNICAL SPECIFICATIONS

Model	TT-71LA13-TIM
System Type	Uncooled LWIR Thermal Imaging Module
Performance
Resolution	1024 x 768 VOx Microbolometer
Pixel Pitch	14 µm
Spectral Band	8-14 µm
Sensitivity (NETD)	≤ 60mK (50mK optional)
TEC	Yes
Video Format
Frame Rate	30Hz
Digital Video	LVDS, 14-bit or 10-bit LVCMOS, Cameralink
Digital Zoom	Continuous digital zoom, from 1 × -4 × (step of 0.1/1)
Power System
Input Voltage	5.2 – 6 V Base configuration
	5 – 24 V Base configuration with expansion board
Typical input Voltage	5.5V Base configuration
	12V Base configuration with expansion board
Power Consumption	≤ 2.8W
	≤ 3.2W (with expansion board)
Function
Communication Interface	RS-232; RS-422; UART (3.3V)
Image Processing	Digital denoise
	Digital detail enhancement
	Non-Uniformity Correction
Image Control	Polarity: White Hot / black Hot
	Orientation: Vertical /Horizontal/Diagonal
	Pseudo-color: support
	Cross cursor: Display / Hide / Move
Physical Attributes
Size	35mm x 35mm (circuit board)
Weight	≤ 100g
Environmental
Operating Temp Range	-40°C to +60°C
Storage Temp Range	-45°C to +85°C